News

December 12, 2024

Register now for the ECS Brokerage Event 2025

Join the Electonic Components and Systems Community during the ECS Brokerage Event 2025 on 18-19 February in Brussels at Hotel Le Plaza! The number of delegate places available is limited. This is why an application is necessary.

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December 11, 2024

Three Questions on Advanced Packaging for Przemek Gromala from Bosch

Advanced Packaging is one of the major driving topics within the EPoSS Association network. We have interviewed the Leader of the respective EPoSS Task Force on Advanced Packaging Przemek Gromala from Bosch. He took the time to answer three questions:.

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December 10, 2024

ECS-SRIA 2025 published

The eighth edition of the Electronic Components and Systems (ECS) Strategic Research and Innovation Agenda (ECS-SRIA) has been released. It is coordinated by the Industry Associations AENEAS, EPoSS and INSIDE and shaped by the experts of the ECS community. This edition reflects the most recent technological and strategic trends of the ECS industry.

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December 9, 2024

Three Questions on Advanced Packaging for Lars Lust, Swissbit

Lars Lust is General Manager Advanced Packaging, Assembly & Test Solutions (APATS) and Executive Director of Swissbit Germany AG. In the context of EFECS 2024 in Ghent, we asked him three questions about the chances Lab-to-Fab Accelerators can create for the EU semiconductor industry.

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Picutre of famous building in sevilla in the background, in front announcement of event ITS European Congress

December 6, 2024

Call for Conributions: ITS European Congress 2025 in Seville

Submit your contribution for the ITS European Congress until 16 January 2025! The 16th ITS Congress for Intelligent Transportation Systems in Europe takes place in Sevilla from 19 to 21 May 2025. It unites experts from mobility, technology and policy to advance key European mobility and sustainability initiatives.

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European Technology Platform on Smart Systems Integration

News

Register now for the ECS Brokerage Event 2025

Three Questions on Advanced Packaging for Przemek Gromala from Bosch

ECS-SRIA 2025 published

Three Questions on Advanced Packaging for Lars Lust, Swissbit

Call for Conributions: ITS European Congress 2025 in Seville

EPoSS

8th edition of the Electronic Components and Systems Strategic Research and Innovation Agenda

A White Paper on Green ECS