News

EPoSS Working Group Advanced Packaging kindly invites to join the Brokerage for Lab to Fab Accelerator projects on Advanced Packaging on November 7, 2025 12:30 – 14:30 CET in Berlin, Germany, at Fraunhofer IZM (onsite only!). The brokerage will take...

The transition in the automotive industry towards software-defined and hardware-enabled vehicles (SDVs) is reshaping the entire value chain. Smart systems are at its core, from chip and sensor development to E/E architecture design, from mechatronic system and component integration to...

The ECS Brokerage 2026 will take place on 4-5 February 2026 in Brussels. This time, the event will move to a new location: The Egg, Brussels.

Secure your spot today! The registration for EFECS – the European Forum for Electronic Components and Systems, is officially open. It will take place in Malta, on December 3–4, 2025, at the Hilton Hotel in St. Julian’s –  the very...

On 5 September 2025, the European Commission has launched a Public Consultation and Call for Evidence on the evaluation and review of the Chips Act. They kindly invite stakeholders to provide feedback on the current functioning of the Chips Act...

It will take place from June 16-19 in Braga, Portugal, kindly hostet by the EPoSS member INL.

Submit your RD&I collaborative Project OUTLINE for the Xecs Call 5 in the field of Electronic Components & Systems and its applications Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components...

This was the EPoSS Annual Forum 2025! From June 3 to 6, 2025 the European Smart Systems Communty met in Neuchâtel, Switzerland for the EPoSS Annual Forum. The event was kindly hosted by EPoSS Member CSEM. More than 120 guests...

Fascinating Electronics for a Cool World – If you are a STEM student, seize this opportunity and apply today until 18 May 2025 for the ECS Summer School 2025  

The Call for Presentations and Posters for the EPoSS Annual Forum 2025 is now open!

Join the Electonic Components and Systems Community during the ECS Brokerage Event 2025 on 18-19 February in Brussels at Hotel Le Plaza! The number of delegate places available is limited to maximise the opportunities for a genuine exchange between the participants....

Advanced Packaging is one of the major driving topics within the EPoSS Association network. We have interviewed the Leader of the respective EPoSS Task Force on Advanced Packaging Przemek Gromala from Bosch. He took the time to answer three questions:

The eighth edition of the Electronic Components and Systems (ECS) Strategic Research and Innovation Agenda (ECS-SRIA) has been released. It is coordinated by the Industry Associations AENEAS, EPoSS and INSIDE and shaped by the experts of the ECS community. This...

Lars Lust is General Manager Advanced Packaging, Assembly & Test Solutions (APATS) and Executive Director of Swissbit Germany AG. In the context of EFECS 2024 in Ghent, we asked him three questions about the chances Lab-to-Fab Accelerators can create for...

Submit your contribution for the ITS European Congress until 10 January 2025!

The Call for Papers for the Smart Systems Integration Conference & Exhibition – SSI 2025 is now open. The deadline for submitting abstracts is 20 December 2024. The SSI 2025 will take place from 8-10 April 2025 in Prague, Czech Republic. Once again, it...

The Satellite Workshop ‘Turn risks into chances: Closing gaps in the semiconductor value chain’, planned by ICOS – International Cooperation On Semiconductors for 4 December 2024, from 3.30 to 5.30 p.m. in Ghent, will not take place. Alternatively, there will be an opportunity...

Have you already registered for the EFECS 2024 taking place on December 5 and 6 in Ghent? Register today and join to connect with leaders and innovators driving the future of electronics and semiconductor tech, powered by Chips JU and...