News

In preparation for the Work Programme for 2027, Chips JU is organising an online consultation workshop on the 5th of October 2026. The proposed topic intends to address sustainable semiconductor manufacturing, with different actions. 📅 5 October 2026 🕙 13:30...

Join us in shaping the Chips JU Work Programme 2027! n preparation for the Work Programme for 2027, Chips JU is organising an online webinar on the 6th of October 2026. The workshop will be organised on the theme of...

Join us in shaping the Chips JU Work Programme 2027! In preparation of the Work Programme 2027, the Chips JU is organising a consultation workshop on October 5th, 2026. The workshop will explore how the Pilot Lines established under the Chips...

Join us in shaping the Chips JU Work Programme 2027! EPoSS is pleased to support the Online Consultation Workshop on “Co-Packaged Optics & System-Level Design for Heterogeneous Integration” on 5 October 2026, organised by Chips Joint Undertaking inviting to discuss...

You will be to SEMICON Europa 2026? Come and meet EPoSS at the Chips Joint Undertaking stand! 📍 Hall C2 | Booth C2311 📅 10–13 November 2026 | Munich We are looking foward talking to you!

Join us in shaping the Chips JU Work Programme 2027! EPoSS is pleased to support the Online Consultation Workshop on “Chips for AI, AI for Chips” on 6 October 2026, organised by Chips Joint Undertaking inviting to discuss potential directions...

The EPoSS Annual Forum 2027 will take place from June 08 to 11 in Helsinki, Finland, kindly hosted by the EPoSS member VTT Technical Research Centre of Finland.  

86 European associations representing key RD&I stakeholders urgently call on EU Institutions to act with commensurate ambition in designing and funding the next Framework Programme for Research and Innovation (FP10). Along with the other organisations, EPoSS calls on EU Institutions...

SUBMIT YOUR RD&I COLLABORATIVE PROJECT OUTLINE FOR THE FIRST XECS QUANTUM CALL Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. The first Xecs Quantum Call...

EPoSS, Inside and Aeneas have published a new White Paper: From Chips to Healthcare Services: How Europe’s digital innovation continuum is reshaping the future of health and wellbeing.   

The ECS Brokerage 2026 will take place on 4-5 February 2026 in Brussels. This time, the event will move to a new location: The Egg, Brussels.

The Industry endorsement of the Semiconductor Coalition declaration now has 86 co-signatories. EPoSS is one of them calling for  bold action, proper preconditions, and a market-driven business case for Europe.

What if the future of Artificial Intelligence was not in the cloud – but at the edge? EPoSS – the European Association on Smart Systems Integration – together with INSIDE, proudly announces the publication of the new white paper: “Artificial...

EPoSS Working Group Advanced Packaging kindly invites to join the Brokerage for Lab to Fab Accelerator projects on Advanced Packaging on November 7, 2025 12:30 – 14:30 CET in Berlin, Germany, at Fraunhofer IZM (onsite only!). The brokerage will take...

The transition in the automotive industry towards software-defined and hardware-enabled vehicles (SDVs) is reshaping the entire value chain. Smart systems are at its core, from chip and sensor development to E/E architecture design, from mechatronic system and component integration to...

The ECS Brokerage 2026 will take place on 4-5 February 2026 in Brussels. This time, the event will move to a new location: The Egg, Brussels.

Secure your spot today! The registration for EFECS – the European Forum for Electronic Components and Systems, is officially open. It will take place in Malta, on December 3–4, 2025, at the Hilton Hotel in St. Julian’s –  the very...

On 5 September 2025, the European Commission has launched a Public Consultation and Call for Evidence on the evaluation and review of the Chips Act. They kindly invite stakeholders to provide feedback on the current functioning of the Chips Act...

The Call for Presentations and Posters for the EPoSS Annual Forum 2025 is now open!

Join the Electonic Components and Systems Community during the ECS Brokerage Event 2025 on 18-19 February in Brussels at Hotel Le Plaza! The number of delegate places available is limited to maximise the opportunities for a genuine exchange between the participants....

Advanced Packaging is one of the major driving topics within the EPoSS Association network. We have interviewed the Leader of the respective EPoSS Task Force on Advanced Packaging Przemek Gromala from Bosch. He took the time to answer three questions:

The eighth edition of the Electronic Components and Systems (ECS) Strategic Research and Innovation Agenda (ECS-SRIA) has been released. It is coordinated by the Industry Associations AENEAS, EPoSS and INSIDE and shaped by the experts of the ECS community. This...

Lars Lust is General Manager Advanced Packaging, Assembly & Test Solutions (APATS) and Executive Director of Swissbit Germany AG. In the context of EFECS 2024 in Ghent, we asked him three questions about the chances Lab-to-Fab Accelerators can create for...

Submit your contribution for the ITS European Congress until 10 January 2025!

The Call for Papers for the Smart Systems Integration Conference & Exhibition – SSI 2025 is now open. The deadline for submitting abstracts is 20 December 2024. The SSI 2025 will take place from 8-10 April 2025 in Prague, Czech Republic. Once again, it...

The Satellite Workshop ‘Turn risks into chances: Closing gaps in the semiconductor value chain’, planned by ICOS – International Cooperation On Semiconductors for 4 December 2024, from 3.30 to 5.30 p.m. in Ghent, will not take place. Alternatively, there will be an opportunity...

Have you already registered for the EFECS 2024 taking place on December 5 and 6 in Ghent? Register today and join to connect with leaders and innovators driving the future of electronics and semiconductor tech, powered by Chips JU and...