background image background image background image
December 11, 2024

Three Questions on Advanced Packaging for Przemek Gromala from Bosch

Advanced Packaging is one of the major driving topics within the EPoSS Association network. We have interviewed the Leader of the respective EPoSS Task Force on Advanced Packaging Przemek Gromala from Bosch. He took the time to answer three questions:

Question 1: What measures need to be taken to strengthen the European ECS ecosystems regarding advanced packaging and our industry’s future needs to stay competitive?

Gromala: „This year, the Pack4EU project, involving active participation from EPoSS members, outlined nine recommendations to strengthen the European ECS ecosystem for Electronic and Advanced Packaging (https://pack4eu.eu/?page_id=577).

Of these, Recommendations 1 and 4 are particularly urgent. Recommendation 1 emphasises the need for a technology transfer instrument from R&D pilot lines to industry, while Recommendation 4 focuses on establishing Advanced Packaging Open Piloting Facilities to support small and medium volume production, tailored to the needs of SMEs.

Question 2: As leader of the respective EPoSS Task Force and as outstanding packaging expert, what do you expect from the Lab2Fab accelerator programme for advanced packaging? What is cooking in other areas of the world?

Gromala: „I expect the Lab2Fab accelerator to enable technology transfer from R&D pilot lines to industry, enhancing European competitiveness in advanced packaging. This is crucial for industries requiring small to medium series solutions. Additionally, significant global investment in advanced packaging is observed across all continents.“

Question 3: Which role does EPoSS play in the context of establishing advanced packaging technologies in Europe?

Gromala: „EPoSS plays a key role in fostering collaboration among industry, research, and academia to advance advanced packaging technologies in Europe. Since 2022, our Task Force and our members have actively contributed to the Pack4EU project, organised workshops, summer schools, and participated in international conferences like ECTC to support the growth of the advanced packaging community in Europe and beyond.“

Other interesting articles

EPoSS supports Workshop Chips for AI | AI for Chips

Join us in shaping the Chips JU Work Programme 2027! EPoSS is pleased to support...

more

EXPANSE AI Scale-up Academy calls for expression interest

Register now for the EXPANSE AI Scale-up Academy! EXPANSE AI is a European initiative (Coordination...

more

Join Consultation Workshop on Low-power Design Techniques for Electronic Components and Systems!

Join us in shaping the Chips JU Work Programme 2027! n preparation for the Work...

more