Events

Special Session ESTC Visual
EPoSS participating
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Special Session during ESTC 2024: The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing

During the 10th IEEE Electronics System-Integration Technology Conference ESTC in Berlin there will be a Special Session on “The Future of Packaging in Europe – Strategies and Funding for R&D and Manufacturing“
Visual_EuroPAT_Website
EPoSS participating
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EuroPAT-Workshop 2024

The 3rd EuroPat Workshop, organised by the SEMI Integrated Packaging Assembly & Testing European Chapter Technology Community (ESiPAT-TC) will take place on September 9-10, 2024 in Berlin.
Summer School 2024 Banner
EPoSS participating
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Summer School 2024: Fascinating Electronics for a Cool World

AENEAS, EPoSS, INSIDE and The European Chips Skills Academy (ECSA) project have joined forces to launch the second edition of the ECS Summer School programme, targeting students who have been enrolled for at least two years of undergraduate studies and have at least one more year to go. This edition of the 'Fascinating Electronics for a Cool World' will be held in Bertinoro, Italy, close to Bologna, 18 to 23 August, 2024. Apply by May 19th, 2024!
Pack4EU Final Event Visual
EPoSS participating
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Pack4EU Final Event

The European Advanced Packaging initiative Pack4EU will hold the project‘s FINAL EVENT. It will take place on June 18, 2024 at the World Trade Center in Grenoble, France and simultanously in Cork, Ireland. Speakers and audiences will be connected online. The event will take place in conjunction with …