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Join the Chips JU annual forum for the Electronic Components and Systems community on 𝟮–𝟯 𝗗𝗲𝗰𝗲𝗺𝗯𝗲𝗿 𝟮𝟬𝟮𝟲 at 𝗠𝗲𝘀𝘀𝘂𝗸𝗲𝘀𝗸𝘂𝘀 𝗛𝗲𝗹𝘀𝗶𝗻𝗸𝗶 𝗘𝘅𝗽𝗼 𝗮𝗻𝗱 𝗖𝗼𝗻𝘃𝗲𝗻𝘁𝗶𝗼𝗻 𝗖𝗲𝗻𝘁𝗿𝗲, 𝗙𝗶𝗻𝗹𝗮𝗻𝗱. This year’s theme, “𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿𝘀 𝗮𝘁 𝘁𝗵𝗲 𝗰𝗿𝗼𝘀𝘀𝗿𝗼𝗮𝗱𝘀: 𝗽𝗼𝗹𝗶𝘁𝗶𝗰𝗮𝗹 𝗽𝗼𝘄𝗲𝗿, 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝗶𝗮𝗹 𝘀𝘁𝗿𝗮𝘁𝗲𝗴𝗶𝗲𝘀 𝗮𝗻𝗱 𝗲𝗰𝗼𝗻𝗼𝗺𝗶𝗰 𝗴𝗿𝗼𝘄𝘁𝗵,” reflects...

Mark your calendars! We are delighted to announce the EPoSS Annual Forum 2027! When? 8–11 June 2027 EPoSS Day: Tuesday, 8 June General Assembly: Wednesday, 9 June Annual Forum: 9–11 June Where? Helsinki, Finland We are pleased to be welcomed...

Meet EPoSS Director Elisabeth Steimetz and Office Manager Katharina Neubert during SEMICON Europa 2026 at the Chips Joint Undertaking stand! 📍 Hall C2 | Booth C2311 📅 10–13 November 2026 | Munich EPoSS will be part of the Chips Joint...

86 European associations representing key RD&I stakeholders urgently call on EU Institutions to act with commensurate ambition in designing and funding the next Framework Programme for Research and Innovation (FP10). Along with the other organisations, EPoSS calls on EU Institutions...

SUBMIT YOUR RD&I COLLABORATIVE PROJECT OUTLINE FOR THE FIRST XECS QUANTUM CALL Xecs is an Eureka Cluster specifically designed to accelerate the pace of sustainable industrial innovation in the Electronics Components & Systems (ECS) community. The first Xecs Quantum Call...

EPoSS Annual Forum 2026 Agenda The agenda for the EPoSS Annual Forum is about to be finalised. Check out the full programme for our gathering next week!

The registration for the EPoSS Annual Forum 2026 Sensing the Future: Building the Intelligent Edge in Braga, Portugal, from June 16 to 19 is now open for general admission. This year, EPoSS member INL – International Iberian Nanotechnology Laboratory kindly agreed to host the...

The deadline for applying for the EPoSS Start-up Award and the POEMS Startup Award have now been extended to May 8, 2026! Do not miss out this opportunity and apply today via contact@smart-systems-integration.org About the EPoSS Start-up Award Since 2019 start-ups from...

AENEAS, EPoSS, and INSIDE Associations have officially launched the preparation of the 10th edition of the Electronic Components and Systems Strategic Research and Innovation Agenda (ECS-SRIA 2027). Members of the ECS community are invited to contribute via the online consultation...

EPoSS, Inside and Aeneas have published a new White Paper: From Chips to Healthcare Services: How Europe’s digital innovation continuum is reshaping the future of health and wellbeing.   

The ECS Brokerage 2026 will take place on 4-5 February 2026 in Brussels. This time, the event will move to a new location: The Egg, Brussels.

The Industry endorsement of the Semiconductor Coalition declaration now has 86 co-signatories. EPoSS is one of them calling for  bold action, proper preconditions, and a market-driven business case for Europe.

What if the future of Artificial Intelligence was not in the cloud – but at the edge? EPoSS – the European Association on Smart Systems Integration – together with INSIDE, proudly announces the publication of the new white paper: “Artificial...

EPoSS Working Group Advanced Packaging kindly invites to join the Brokerage for Lab to Fab Accelerator projects on Advanced Packaging on November 7, 2025 12:30 – 14:30 CET in Berlin, Germany, at Fraunhofer IZM (onsite only!). The brokerage will take...

The transition in the automotive industry towards software-defined and hardware-enabled vehicles (SDVs) is reshaping the entire value chain. Smart systems are at its core, from chip and sensor development to E/E architecture design, from mechatronic system and component integration to...

The ECS Brokerage 2026 will take place on 4-5 February 2026 in Brussels. This time, the event will move to a new location: The Egg, Brussels.

Secure your spot today! The registration for EFECS – the European Forum for Electronic Components and Systems, is officially open. It will take place in Malta, on December 3–4, 2025, at the Hilton Hotel in St. Julian’s –  the very...

On 5 September 2025, the European Commission has launched a Public Consultation and Call for Evidence on the evaluation and review of the Chips Act. They kindly invite stakeholders to provide feedback on the current functioning of the Chips Act...

The Call for Presentations and Posters for the EPoSS Annual Forum 2025 is now open!

Join the Electonic Components and Systems Community during the ECS Brokerage Event 2025 on 18-19 February in Brussels at Hotel Le Plaza! The number of delegate places available is limited to maximise the opportunities for a genuine exchange between the participants....

Advanced Packaging is one of the major driving topics within the EPoSS Association network. We have interviewed the Leader of the respective EPoSS Task Force on Advanced Packaging Przemek Gromala from Bosch. He took the time to answer three questions:

The eighth edition of the Electronic Components and Systems (ECS) Strategic Research and Innovation Agenda (ECS-SRIA) has been released. It is coordinated by the Industry Associations AENEAS, EPoSS and INSIDE and shaped by the experts of the ECS community. This...

Lars Lust is General Manager Advanced Packaging, Assembly & Test Solutions (APATS) and Executive Director of Swissbit Germany AG. In the context of EFECS 2024 in Ghent, we asked him three questions about the chances Lab-to-Fab Accelerators can create for...

Submit your contribution for the ITS European Congress until 10 January 2025!

The Call for Papers for the Smart Systems Integration Conference & Exhibition – SSI 2025 is now open. The deadline for submitting abstracts is 20 December 2024. The SSI 2025 will take place from 8-10 April 2025 in Prague, Czech Republic. Once again, it...

The Satellite Workshop ‘Turn risks into chances: Closing gaps in the semiconductor value chain’, planned by ICOS – International Cooperation On Semiconductors for 4 December 2024, from 3.30 to 5.30 p.m. in Ghent, will not take place. Alternatively, there will be an opportunity...

Have you already registered for the EFECS 2024 taking place on December 5 and 6 in Ghent? Register today and join to connect with leaders and innovators driving the future of electronics and semiconductor tech, powered by Chips JU and...