The event will take place in Munich, 21-22 November 2016.
Forum be-flexible 2016 will have an application oriented program featuring presentations showing the challenges and prospects of the combined forces of thin semiconductor devices and flexible electronic systems for a wide field of applications, such as
- thin silicon
- printing and assembly technologies
- flexible electronic systems
- visions & markets
- and more
The speakers list includes experts from Airbus Group Innovations – Besi Switzerland AG – Coatema Coating Machinery GmbH – Fraunhofer Institute for Integrated Systems and Device Technology, Thin-Film Systems – Soitec – SPTS Newport (UK) – Indian Institute of Technology Kanpur – Interactive Wear – Joanneum Research Forschungsgesellschaft mbH, MATERIALS, Institute for Surface Technologies and Photonics – Koto Electric Co. – LeeLuulights – Munich University of Applied Sciences, Department of Applied Sciences and Mechatronics, Laboratory for Microsystems Technology – Philips Research – University of Surrey, UK - VTT Technical Research Centre of Finland LTD – Yole Developpement and more.
Note that early bird rates are available until 23 October 2016.