Forum be-flexible 2016: Thin Semiconductor Devices & Flexible Electronic Systems for the Internet of Things

Forum be-flexible 2016 SQUARE


Munich, Germany

The event will take place in Munich, 21-22 November 2016.

Forum be-flexible 2016 will have an application oriented program featuring presentations showing the challenges and prospects of the combined forces of thin semiconductor devices and flexible electronic systems for a wide field of applications, such as

  • lifestyle
  • wearables
  • consumables
  • health
  • robotics
  • thin silicon
  • printing and assembly technologies
  • flexible electronic systems
  • visions & markets
  • sensors
  • security
  • and more

The speakers list includes experts from Airbus Group Innovations – Besi Switzerland AG – Coatema Coating Machinery GmbH – Fraunhofer Institute for Integrated Systems and Device Technology, Thin-Film Systems – Soitec – SPTS Newport (UK) – Indian Institute of Technology Kanpur – Interactive Wear – Joanneum Research Forschungsgesellschaft mbH, MATERIALS, Institute for Surface Technologies and Photonics – Koto Electric Co. – LeeLuulights – Munich University of Applied Sciences, Department of Applied Sciences and Mechatronics, Laboratory for Microsystems Technology – Philips Research – University of Surrey, UK - VTT Technical Research Centre of Finland LTD – Yole Developpement and more.

Note that early bird rates are available until 23 October 2016.