EuroSimE 2017: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

The event will take place in Dresden, 2-5 April 2017, with the first day being dedicated to training courses.

Organised by Fraunhofer Institute for Ceramic Technologies and Systems IKTS, EuroSimE 2017 will be hosted in the city of Dresden at the Dresden Westin Bellevue hotel.

Short courses will be offered for professional training on April 2, 2017.

Three days of technical sessions (April 3–5, 2017) for oral and poster presentations are planned, in parallel with an exhibition of suppliers of experimental characterization, simulation and optimization equipment demonstrating their latest features.

The best papers will be selected for publishing in Elsevier magazines on Microelectronics Reliability and Mechatronics.

The conference will address the results of fundamental research and industrial applications for thermal, mechanical and multiphysics simulation and experiments of micro/nano-electronics and microsystems.

Subjects

• Multi-physics simulation (e.g. thermal, mechanical,
  thermo-mechanical, coupled thermo-fluidic, coupled
  electro-mechanics, fluid structure interactions)
• Material characterisation, experiments and modelling
• Integrated process modelling
• Simulation-based optimisation, virtual prototyping in
  product and process design
• Advanced numerical and analytical simulation
  methodologies and tools
• Multiscale modelling and simulation
• Compact modelling and model order reduction
• Behavioural modelling
• Experimental methods for validation of simulation
  models
• Failure analysis and failure mode extraction
• Failure criteria and damage modelling for reliability
  prediction
• Prognostics and Health Monitoring
• Additive Manufacturing 3D Printing, 3D packaging

Applications