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EuroSimE 2016: IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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This event will take place in Montpellier, France, 17-20 April 2016.

  • Conference
When 17 April 2016 09:00 AM to
20 April 2016 05:00 PM
Where Montpellier, France
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The conference will address the results of both fundamental research and industrial applications for thermal, mechanical and multiphysics simulation and experiments of micro/nano-electronics and microsystems.

Short courses will be offered for professional training on 17 April 2016. Three days of technical sessions (18-20 April 2016)   for   oral   and   poster   presentations   are   planned,   in   parallel   with   an   exhibition   of suppliers   of   experimental characterization equipment, and simulation and optimization demonstrating their latest features.

EuroSimE 2014


  • Multi-physics   simulation   (e.g.   thermal,   mechanical,   thermo-mechanical,   coupled   thermo-fluidic,   coupled   electro-mechanics, fluid structure interactions)
  • Material characterisation, experiments and modelling 
  • Integrated process modelling
  • Simulation-based   optimisation,   virtual   prototyping   in   product and/or process design
  • Advanced   numerical   and   analytical   simulation   methodologies and tools
  • Multiscale modeling and simulation
  • Compact modelling and model order reduction
  • Behavioural modelling
  • Validation of simulations by experiments
  • Failure analysis and failure mode extraction
  • Failure criteria and damage modelling for reliability prediction
  • NEW: Prognostics and Health Monitoring
  • NEW: 3D Printing, 3D packaging


  • Components and packaging
    • Flip-chip,   BGA,   CSP,   Wafer-Level   packages,   MCM, Cu/low-k packages
    • 3-D packaging
    • Opto-electronic packages
    • High temperature and high power packaging
    • Packaging for harsh environments
  • Microsystems
    • Piezoelectric components
    • MEMS sensors and actuators
    • Opto-mechanical devices
    • Nano-electronic mechanical devices
    • Bio-MEMS/NEMS
    • Microfluidics
  • LED lighting
  • Smart systems of 2nd and 3rd generation
  • Electronic control units for harsh environment

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