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DTIP2016: Design, Test, Integration & Packaging of MEMS/MOEMS

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The event will take place in Budapest, 30 May - 2 June 2016.

What
  • Conference
When 30 May 2016 11:50 AM to
02 June 2016 11:50 AM
Where Budapest, Hungary
Contact Email
Contact Phone +33(0)467.418.527
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DTIP2016 will be the 18th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique single-meeting event brings together participants interested in MEMS/MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS/MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks.  Selected papers will appear in IEEE Xplore and extended papers would be submitted in a special issue of an indexed journal.

DTIP2016

Conference website: http://www.dtip-mems.org

Call for Papers: http://www.dtip-mems.org/pages/cfp.html

Technical Programme: http://www.dtip-mems.org/pages/program.html

Registration: http://www.dtip-mems.org/pages/registration.html

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