Advanced Packaging and 3D Heterogeneous Integration for RF/mmWave Applications

Pack4EU kindly invites to the KDT consultation workshop Advanced Packaging and 3D Heterogeneous Integration for RF/mmWave Applications organised by the CSA Pack4 EU on behalf of the KDT JU.

Goals of this workshop are:

• Introduction of RF/mmWave activities in Europe: running EU projects and state-of the art of the technologies
• Consultation on planned focus topic call (IA) “Packaging and 3D Heterogeneous Integration for RF/mmWave Applications” towards 6G and other future applications
• Initiate the built of consortia on the topic and discuss commonly about future R&D&I needs to industrialise the integration of RF/mmWave components

Please register here for the Workshop: https://vdivdeit.webex.com/weblink/register/r37cc05d6678972bd194c940765280bd8

You wish to contribute or pitch your company or project idea? Please approach Dr. Elisabeth Steimetz, VDI/VDE-IT, elisabeth.steimetz@vdivde-it.de.

Please find the agenda for download below. Further information is available on the KDT/Chips JU website.