Special Session during ESTC 2024: The Future of Packaging in Europe - Strategies and Funding for R&D and Manufacturing

On Thursday, September 12, 2024, there will be a Special Session on “The Future of Packaging in Europe – Strategies and Funding for R&D and Manufacturing“. 

The session is part of the 10th IEEE Electronics System-Integration Technology Conference ESTC in Berlin that will be held at the MOA Berlin Hotel, Stephanstraße 41, 10559 Berlin. Steffen Kröhnert (ESPAT Consulting) and Klaus Pressel (Infineon) will guide through the session which consists of two parts:  

• Session Part I from 1:45 to 3:15pm
• Session Part II from 3:45 to 5:15pm

The first part will cover topics such as the Impact of PreAssembly and Failure Analysis in IPCEI ME/CT or Digital Twin – Challenges and Opportunities in IPCEI ME/CT. The second part is about topics such as the EU Chips Act, Pack4EU and a panel discussion on the future of packaging in Europe. The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe.

Registration is available here.  
Further information and details of the session agenda can be found on the event website. 

Don't miss out!