EuroPAT-Workshop 2024

The 3rd EuroPat Workshop, organised by the SEMI Integrated Packaging Assembly & Testing European Chapter Technology Community (ESiPAT-TC) will take place on September 9-10, 2024 in Berlin. 

Themed "Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing?", attendees are promised insightful discussions on the collaboration between Outsourced Semiconductor Assembly and Test (OSAT) providers and Semiconductor Packaging, Assembly, and Test Service Providers (SPAT-SPs).

Learn all about the event here. 

For any questions related to the registration or payment, please contact the SEMI Team.
For any questions about the event and its content, please contact steffen.kroehnert@espat-consulting.com.