ECTC - 2024 IEEE 74th Electronic Components and Technology Conference

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

EPoSS Director, Elisabeth Steimetz will speak during the Special Session on Industry-Government Co-Investments "Exploring the Impact of Industry-Government Co-Investments for the Advanced Electronics Sector in North America, Asia and Europe"

Tuesday, May 28, 2024, 8:30 a.m. – 10:00 a.m. 
Aurora B 

The Special Session will be chaired by Przemyslaw Gromala, Robert Bosch GmbH, and Erik Jung, Fraunhofer IZM. 

Background

Essential to the global economy and innovation landscape, the semiconductor and microelectronics packaging industries are seeing government led investment programs. The introduction of the CHIPS and Science Act (Creating Helpful Incentives to Produce Semiconductors for America) in the United States has been inspiring similar programs, e.g. in Europe the European Chips Act. Speakers in this special session discuss programs and co-investments for the United States, Europe, India and East Asia, including job creation, supply chain resilience, and enhanced technological innovation. We will examine the prospects of global collaborations and partnerships between national semiconductor and microelectronic packaging centers and industry leaders. The session will also discuss mechanisms for knowledge exchange, joint research initiatives, and mutually beneficial outcomes. 

The Speakers

Elisabeth Steimetz, EPoSS, Europe; Rao Tummala, Advisor to the Government of India; Eric Lin, CHIPS Research and Development Program, USA; David Lynch, CMC Microsystems, Canada; Kwang-Seong Choi, Electronics and Telecommunications Research Institute, Korea

Learn all about the event here.