The 25th European Microelectronics & Packaging Conference (EMPC 2025)

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Location

World Trade Center Grenoble

Address

5-7 Pl. Robert Schuman
38000 Grenoble
France

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The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.

The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

Please find here all information about the event.