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EuroSimE 2016: Call for Papers

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The Call for Papers for EuroSimE 2016 is open until 30 October 2015. The event will take place in Montpellier, France, 17-20 April 2016.

About the Conference

The   EuroSimE   conference,   EuroSimE   2016,   will   be   hosted   in Montpellier. The conference will address the results of both fundamental research and industrial applications for thermal, mechanical and multiphysics simulation and experiments of micro/nano-electronics and microsystems.

Short courses will be offered for professional training on 17 April 2016. Three days of technical sessions (18-20 April 2016)   for   oral   and   poster   presentations   are   planned,   in   parallel   with   an   exhibition   of suppliers   of   experimental characterization equipment, and simulation and optimization demonstrating their latest features.

The   best   papers   will   be   selected   for   possible   publishing   in   Elsevier   magazines   on   Microelectronics   Reliability   and Mechatronics.

Milestones

  • Abstract submission deadline: 30 October 2015
  • Notification of acceptance: 18 December 2015
  • Full manuscript submission deadline: 01 March 2016

Topics

  • Multi-physics   simulation   (e.g.   thermal,   mechanical,   thermo-mechanical,   coupled   thermo-fluidic,   coupled   electro-mechanics, fluid structure interactions)
  • Material characterisation, experiments and modelling 
  • Integrated process modelling
  • Simulation-based   optimisation,   virtual   prototyping   in   product and/or process design
  • Advanced   numerical   and   analytical   simulation   methodologies and tools
  • Multiscale modeling and simulation
  • Compact modelling and model order reduction
  • Behavioural modelling
  • Validation of simulations by experiments
  • Failure analysis and failure mode extraction
  • Failure criteria and damage modelling for reliability prediction
  • NEW: Prognostics and Health Monitoring
  • NEW: 3D Printing, 3D packaging

Applications

  • Components and packaging
    • Flip-chip,   BGA,   CSP,   Wafer-Level   packages,   MCM, Cu/low-k packages
    • 3-D packaging
    • Opto-electronic packages
    • High temperature and high power packaging
    • Packaging for harsh environments
  • Microsystems
    • Piezoelectric components
    • MEMS sensors and actuators
    • Opto-mechanical devices
    • Nano-electronic mechanical devices
    • Bio-MEMS/NEMS
    • Microfluidics
  • LED lighting
  • Smart systems of 2nd and 3rd generation
  • Electronic control units for harsh environment

Important Links

  • For Abstract Submission please click >>here
  • Event Website >>here

 

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