Based on an symposium organized within the framework of the IEEE Sensors 2012 Conference in Taipei in November 2012, now a Special Issue of the IEEE Sensors Journal on "Material-integrated Sensing" will be organized.
Submission deadline
Deadline for submitting your proposals is 31th August 2013.
Call for Papers
The call for papers can be found here.
Topics
- Sensors and electronics for material integration
- Interfacing technologies
- Reliable and robust data processing
- Reliable and robust communication
- Energy supply
- Application scenarios
Paper submission
Paper submission must be done online here. When submitting, please indicate in the “Manuscript Type” roll-down menu, and also by e-mail to Ms. Alison Larkin, that the paper is intended for the “Material-integrated Sensing” Special Issue.
The guidelines for paper preparation and submission are available here.
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