The deadline for abstract submission is 15 September 2013. The event will take place in Munich, 20-21 November 2013.
2013 motto: systems integration - killer applications - best practice - roadmapping ? - no go’s - lessons learned
As in the past, there is the opportunity to present your latest developments, recent successes and approaches to an international audience. Presentation proposals are invited for the following topics:
Thin Semiconductor Devices - sessions on November 20, 2013
- wafer thinning and handling
- thin wafer processing
- thin devices - applications
- flexible systems - applications
Flexible Electronic Systems - sessions on November 21, 2013
- smart and flexible systems
- production technologies for flexible systems
- organic electronics and functional materials
- best practice, case studies, product design and market perspectives of flexible systems and product design
Speakers attend the respective workshop day for free.
Deadline for submitting abstracts: September 15, 2013.
Please note that slots for presentations are limited. Acceptance of presentations is subject to the stated sessions and completeness of the requested information, see details at http://www.be-flexible.de/cfp_spinfo.html
Important: please submit your presentations only via webform !! Submissions by email are not acepted.
Required information for submitting abstracts:
- Title of presentation: max 55 characters including blanks
- Speaker: max 55 characters including blanks
- Abstract: max 1500 characters including blanks
- Speaker’s biography: max 1500 characters including blanks
- Company’s name and address: max 150 characters including blanks (link optional)
The information provided will be used for the flyer and handouts
Notification of acceptance by september 20, 2013.
Preliminary agenda on the web shortly after.
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