Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging

The EPoSS Working Group Advanced Packaging invites to the Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging taking place on September 18, 2025 15:30 – 17:30 CEST in Grenoble, France, at the World Trade Center (onsite only). The workshop has been arranged in conjunction with and is kindly hosted by the EMPC 2025 | The 25th European Microelectronics & Packaging Conference (EMPC 2025).

Sep 18, 2025 15:30 - 17:00

World Trade Center, Grenoble, France

Registration via: https://pretix.eu/eposs/LabToFab/ Program

Program

What awaits you?

Chips JU is currently preparing the launch of two calls for Advanced Packaging. The goal of the workshop is inform the community about the call content and to initiate consortia building. The respective draft call https://www.chips-ju.europa.eu/CallDetails/?id=2af90e5b-d984-f011-b4cc-000d3ab33b4d has been published on September 2, 2025.

Please register here for the workshop: https://pretix.eu/eposs/LabToFab/. The workshop will take place onsite only. Find us also in a dedicated booth!

If you are not able to join, but you are interested in the calls and funding opportunities, please do not hesitate to contact the EPoSS Office via contact@smart-systems-integration.org.