Electronic Packaging Days 2025

Details on the event and registration can be found on the event website.

• 11:00 – 11:30 Coffee & Welcome
• 11:30 – 12:00 Keynote: Packaging is Shaping Future Electronics | Prof. Ulrike Ganesh
• 12:00 – 13:00 Session: 1.1: The APECS Pilot Line | Session Chair: Rolf Aschenbrenner
  Keynote: Enabling the Future – APECS Pilot Line | Rolf Aschenbrenner
  Navigating the Future: Innovation and Roadmapping in Wafer Level Packaging | Dr. Manuela Junghähnel
  Next-Level Panel Level Packaging | Ruben Kahle
  How to Use the Pilot Line – Strategic Partnerships and Service Offer | Erik Jung
  13:00 – 14:00 Lunch
• 14:00 – 15:00 Session: 1.2: Chiplet – Driving Force for High Performance Computing | Session Chair: Dr. Michael Schiffer
  Keynote: Function-Driven Innovation: How Technology Follows the Needs of Chiplet Systems | Dr. Michael Schiffer
  Size Does Matter: How HPC Module Form factors Increase with Chiplet Technology | Dr. Ole Hölck
  High-Speed Design, Fabrication and Assembly of Interposers on System Boards for Chiplets and HPC | Dr. Alexander Gäbler
  High-End Performance Packaging – Latest Trends | Markus Wöhrmann
• 15:00 – 17:00 Coffee Break – Networking – Expert Sessions – Lab Tours
• 17:00 – 18:15 Session: 1.3: Sustainable Electronics | Session Chair: Dr. Nils F. Nissen
  Keynote: Why the IT Giants Are on the Quest for Enhanced Environmental Transparency | Karsten Schischke
  Going Green Combines Environmental, Reliability and Business Aspects | Dr. Nils F. Nissen
  Green Deal for Microelectronics – Material & Energy Efficiency by Design | Carsten Brockmann
  Presentation of the IZM Researcher Award 2025: Energy and Carbon Footprint of Advanced Computer Hardware for HPC and AI Systems | Dr. Lutz Stobbe
• 18:15 – 22:15 Get-together

• 08:30 – 9:00 Coffee & Welcome
• 09:00 – 10:00 Session: 2.1: Future Compute I | Session Chair: Dr. Tanja Braun & Dr. Michael Schiffer
  Keynote: Material Trends in High-End Performance Packaging | Prof. Martin Schneider-Ramelow
  Photonics for AI Data Centers Dr. Tolga Tekin
  Photonic Glass Core Substrates for Data Centers and Optical Computing | Julian Schwietering
• 10:00 – 10:45 Session: 2.2: Future Compute II | Session Chair: Dr. Tanja Braun
  Keynote: Tailoring Packaging for Advanced Quantum Applications | Dr. Hermann Oppermann
  Soft Medical-Grade Substrates for Neural Interfaces | Prof. Vasiliki Giagka
  Packaging Technology in the Digital Realm: Digital Twins & AI-related Tools | Karl-Friedrich Becker
• 10:45 – 11:45 Coffee Break – Networking – Expert Sessions – Lab Tours
• 11:45 – 12:30 Session: 2.3: Power Electronics | Session Chair: Dr. Andreas Middendorf
  Keynote: Power Electronics – Strategies for a Cost-Effective Production | Prof. Eckart Hoene
  Molded Packages for Power Devices – Technologies and Specifications | Tina Thomas
  Challenges of Reliable Power Electronics | Dr. Stefan Wagner
• 12:30 – 14:30 Lunch Break – Networking – Expert Sessions – Lab Tours
• 14:30 – 15:15 Session: 2.4: RF System Integration meets Leading Edge Packaging | Session Chair: Harald Pötter
  Keynote: RF Packaging Architectures and Design for Communication, Sensing, Computing and AI Applications | Prof. Ivan Ndip
  Application-Specific Design and Packaging of Radar Modules and Systems | Dr. Christian Tschoban
  Design for Reliability of Advanced Packages for 5G and 6G Wireless Infrastructure | Dr. Johannes Jaeschke
• 15:15 – 15:30 Recap & Farewell Prof. Ulrike Ganesh and Prof. Martin Schneider-Ramelow

• Cleanroom
• Material Characterization | Corrosion Lab
• System Integration & Interconnection Technologies
• Condition Monitoring (ECM Lab)
• Analytics (FIB, REM & XPS | ESCA)
• EBSD & Moisture Lab APECS Pilot line
• Assembly & Encapsulation Lab
• Substrate Line
• Electronic Textile Lab
• Photonic Lab
• Power Lab
• Functional Testing of Compact Radar Modules
• Energy Efficiency and Functional Testing
• RF for Material, Interconnect and Antenna Testing
• Next-Generation 3D Heterointegration at 300mm (digital)

Expert Sessions:

• Wafer Level System Integration
• System Integration & Interconnection Technologies
• Environmental & Reliability Technologies
• RF & Smart Sensor Systems
• APECS Pilot line

You will be asked to register for individual guided tours and expert sessions when you register.