47th IMAPS Poland and 18th COE

Scope of IMAPS:

Hybrid and Semiconductor Technologies
Design Methods and Computer Simulations
Electronic Materials and Components
Microcircuits Applications
Thick-Film and Thin-Film Technologies
Sensors and Sensing Materials
Packaging and PCB Technologies
Quality and Reliability Evaluation
Thermal Management

Scope of COE:

Theory, modelling and design of sensors, transducers and actuators
New materials and technologies for sensors, micro and nanosystems
Physical quantities sensors
Environmental sensors
Sensors and miniaturised systems for space exploration and medicine
Quantum sensors
Electrochemical, semiconductor and electrocatalytic gas sensors
Biosensors and lab-on-chips
Optoelectronic sensors, fiber optic and image converters
MEMS, optical MEMS, RF MEMS, NEMS
Sensory networks, transmission systems, Internet of Things, Industry 4.0
Applications and metrological aspects of sensors and microsystems

Participants are kindly requested to submit their abstracts by May 20.
Authors will be informed about the acceptance of their abstracts by May 30.
Reduced early bird registration fees will be available for participants who complete their registration by May 30.

Learn all about the event on the event website.

Participants of this year’s IMAPS conference will have the opportunity to publish extended versions of their work in a Special Issue of the journal MDPI Sensors, titled “Passive RFID Technology: Integrated Communications and Sensing” (Impact Factor: 3.5, CiteScore: 8.2)