EPoSS - The Product Driven Platform

Production Capabilities

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Fabrication of sensors

Description Picture
Current Use
III-V Device fabrication facility
Fabrication of sensors

Development of sensors in range of application areas
MRL RTO
Contact
9/10
Tyndall National Institute, University College Cork, Ireland (www.tyndall.ie)
Dr Eric Moore eric.moore@tyndall.ie


High temperature packages

Description Picture
Current Use
Fabrication of ceramic packages for extreme temperatures (> 500°C)
High temperature packages

In research project demonstrations
MRL RTO
Contact
4
Swerea IVF AB, Mölndal, Sweden (www.swereaivf.se)
Klas Brinkfeldt klas.brinkfeldt@swerea.se


High temperature interconnects

Description Picture
Current Use
Sintered silver interconnects for temperatures up to 600°C
High temperature interconnects

In research project demonstrations and process optimization
MRL RTO
Contact
4
Swerea IVF AB, Mölndal, Sweden (www.swereaivf.se)
Klas Brinkfeldt klas.brinkfeldt@swerea.se


Printed circuit board assembly

Description Picture
Current Use
Lead free and leaded production
Printed circuit board assembly

Prototype manufacturing/process optimization
MRL RTO
Contact
4 and 10
Swerea IVF AB, Mölndal, Sweden (www.swereaivf.se)
Per-Erik Tegehall, per-erik.tegehall@swerea.se


Flexible fully automatic AVT mounting center

Description Picture
Current Applications
The modular system concept allows the implementation of most important AVT-assembly steps in one device. Special functions like laser soldering, dispenser for solder paste or -jetting, pick & place of fragile components, high-precision and very fast accurate positioning of UV-LEDs, innovative joining processes such as Thermosonic bonding can be realized with this platform
Automatic AVT mounting center

Automatic AVT mounting center

Assembly of LED modules, especially flip chip bonded UV LEDs, in different designs and sizes
TRL RTO
Contact
4 for UV LEDs , 6 for VIS
CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Olaf Brodersen
obrodersen@cismst.de

Fabrication of micromechanical and optical silicon sensors

Description Picture
Current Use
Fabrication facility for
  • piezoresistive sensor chips,
  • photodetectors,
  • photodetector arrays, and
  • radiation detectors
Fabrication of micromechanical and optical silicon sensors

Silicon wafer processing

Industry automation, precision measurement and basic physic research as well as harsh environment applications
MRL RTO
Contact
8
CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de)
Dr. Thomas Ortlepp tortlepp@cismst.de


Fabrication of microfluidic disposables

Description Picture
Current Use
  • Throughput of up to 200,000 test carriers annually
  • Clean room ISO 7
  • Forming, filling and sealing of test carriers
Fabrication of microfluidic disposables

Mainly for centrifugal microfluidic test carriers, e.g. LabDisks, but potentially other disposables as well
MRL RTO
Contact
7
Hahn-Schickard Freiburg, Germany www.Hahn-Schickard.de
Dr Daniel Mark Daniel.Mark@Hahn-Schickard.de


Fabrication of Molded Interconnected Devices (MID)

Description Picture
Current Use
Pilot line for MID fabrication
Fabrication of Molded Interconnected Devices (MID)

MID on work piece carrier

Sensor devices for medical technology application
MRL RTO
Contact
8
Hahn-Schickard, Stuttgart, Germany www.hahn-schickard.de Dr. Ulrich Kessler Ulrich.Kessler@Hahn-Schickard.de


Fabrication of micro systems

Description Picture
Current Use
Facilities for
  • injection molding,
  • metal plating,
  • laser processing,
  • printing, and
  • advanced micro assembly
Fabrication of micro systems

3D Assembly cluster

Actuator and sensor systems
MRL RTO
Contact
8
Hahn-Schickard, Stuttgart, Germany www.hahn-schickard.de Dr. Ulrich Kessler Ulrich.Kessler@Hahn-Schickard.de


MRL:Manufacturing Readiness Level

 

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