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mstnews - June 2009 issue available for download

Packaging, Interconnection and Assembly

The new June 2009 issue no. 3/09 of the magazine mstnews has just been published on Packaging, Interconnection and Assembly.

This issue also includes a report on the AMAA Conference, and a special EPoSS page with information on the EPoSS Proposers' Day for FP7 ICT Call 5 Challenge 3 to be held on 15th June 2009 in Berlin.

The current issue together with recent issues is available for download under http://www.mstnews.de/downloads

For further information, please contact:

VDI/VDE Innovation + Technik GmbH
Bernhard Wybranski, chief editor mstnews
Steinplatz 1, 10623 Berlin / Germany
Phone/Fax: +49 30 310078 167/223
E-Mail: mstnews@vdivde-it.de
URL: www.mstnews.de


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