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SMT Hybrid Packaging 2013

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The conference SMT Hybrid Packaging 2013-System Imtegration in Microelectronics, will be held on 16-18 April 2013 in Nürenberg.

  • Conference & Exhibition
When 16 April 2013 08:00 AM to
18 April 2013 05:00 PM
Where Nuremberg, Germany
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SMT Hybrid Packaging is one of the Europe´s leading events on System Integration in Micro Electronics.

The SMT Hybrid Packaging conference is an important platform for information and networking in the field of microelectronics manufacturing in Europe.

International experts from industry and science,

  • present current and future developments in electronics manufacturing
  • offer solutions for special problems
  • and are inviting all delegates to discuss and exchange their experiences.

SMT Hybrid Packaging 2013

Exhibition Topics

The SMT Hybrid Packaging shows the complete spectrum on System Integration in Micro Electronics. This international meeting point in the field of electronic manufacturing offers the latest products, services and solutions. From Assembly, PCB, Soldering to Test - the complete market overview under one roof.

  • Assembly
  • Components 
  • Design and Development
  • EMS
  • PCB production 
  • Packaging
  • Screen Printing
  • Soldering
  • Test Systems
    and many more


The program consists on the one hand of a high-class, user-oriented conference day in German, which deals with current issues. On the other hand a large number of practice-oriented half-day tutorials in German and English offers information and results at first hand.

International experts from industry and science present current and future developments in electronics manufacturing, offer solutions for special problems and are inviting all delegates to discuss and to exchange their experiences.

The detailed programme will be available on December 2012.

More information about this event…

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