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SMT Hybrid Packaging - System Integration in Micro Electronics

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Meet the industry's leading companies for SMT Equipment, Components and SMT Services in Nuremberg, Germany, 8 - 10 May 2012. Please note: The conference and some of the tutorials are in German.

  • Conference & Exhibition
When 08 May 2012 09:00 AM to
10 May 2012 05:00 PM
Where Nuremberg, Germany
Contact Name Maren Cerkez / Daniela Ebert
Contact Phone +49 711 61946-74 / +49 711 61946-822
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Parallel to the exhibition, the SMT Hybrid Packaging conference and tutorials are the most important platform for information and networking in the field of micro electronics manufacturing in Europe.

The conference will for one day focus on presentations and discussions on the topic „Technology of Printed Circuit Boards for Electrical Mobility“. In addition to that there will be, as usual, practice-oriented half-day tutorials providing basic and expert knowledge.  The extensive program will offer trend setting topics with clear advantages for users.

SMT Hybrid Packaging

International experts from industry and science present current and future developments in electronics manufacturing, offer solutions for special problems and are inviting all delegates to discuss and to exchange their experiences.

For the full programme of the event Click Here

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