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Forum "be-flexible" 2012

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The event will take place in Munich, 21-22 November 2012.

What
  • Workshop
When 21 November 2012 09:00 AM to
22 November 2012 05:00 PM
Where Munich, Germany
Contact Name Gabriele Reiner
Contact Email
Contact Phone +49. 89. 54 759 -538
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The Motto in 2012 is Systems Integration:

  • killer applications
  • best practice
  • roadmapping
  • no go’s
  • lessons learned

Fourm "be-flexible" is intended for scientists, applied researchers, equipment suppliers and users, allowing them to exchange ideas and experiences on the world of flexible electronics. Learn about the latest developments, materials & processing & equipments, applications and market perspectives and get in touch with the leading companies and suppliers.

Forum be-flexible

We will be hearing about the latest activities and developments in thin semiconductors and flexible electronics, as well as discussing present and future challenges in this exciing and fast evolving area.

Like every autumn, this workshop is organised by the department Polytronic Systems of Fraunhofer EMFT, in Munich, Germany.

The forum consists of two consecutive days with invited speakers for special foci:

The workshop day on thin semiconductor devices discusses technologies and approaches for wafer thinning and handling of thin and ultra-thin wafers, processing of thin wafers and dicing concepts. It brings up applications such as chip cards and power devices and deals with the potential of the system integration of thin chips such as usage in portable electronic equipment, or enhancing performance of components. One topic handles the cost-efficient (self-)assembly on flexible substrates for very flat packages such as 3D-integrated chip stacks (MEMS, CSP), opto-electronic devices (LED, solar cells) and ultra-thin RFID applications.

The workshop day on flexible electronic systems focuses on thin and flexible, highly functional electronic systems, commonly known as ‘smart systems’, ‘smart textiles’ and ‘ubiquitous applications’. The combination of functional organic and polymer materials and flexible substrates opens a broad perspective towards low-cost and large volume manufacturing. This workshop day brings up functionality and processing of flexible and polymeric materials, machinery, the integration of additional optical functions and components such as sensors or data transfer and possible applications for smart objects.

A call for presentations has been launched for the workshop. Submission is only possible online. The deadline for submission of abstracts is 16 September 2012.

More information about this event…

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