Location
Montpellier, France
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This event will take place in Montpellier, France, 17-20 April 2016.
The conference will address the results of both fundamental research and industrial applications for thermal, mechanical and multiphysics simulation and experiments of micro/nano-electronics and microsystems.
Short courses will be offered for professional training on 17 April 2016. Three days of technical sessions (18-20 April 2016) for oral and poster presentations are planned, in parallel with an exhibition of suppliers of experimental characterization equipment, and simulation and optimization demonstrating their latest features.
Topics
- Multi-physics simulation (e.g. thermal, mechanical, thermo-mechanical, coupled thermo-fluidic, coupled electro-mechanics, fluid structure interactions)
- Material characterisation, experiments and modelling
- Integrated process modelling
- Simulation-based optimisation, virtual prototyping in product and/or process design
- Advanced numerical and analytical simulation methodologies and tools
- Multiscale modeling and simulation
- Compact modelling and model order reduction
- Behavioural modelling
- Validation of simulations by experiments
- Failure analysis and failure mode extraction
- Failure criteria and damage modelling for reliability prediction
- NEW: Prognostics and Health Monitoring
- NEW: 3D Printing, 3D packaging
Applications
- Components and packaging
- Flip-chip, BGA, CSP, Wafer-Level packages, MCM, Cu/low-k packages
- 3-D packaging
- Opto-electronic packages
- High temperature and high power packaging
- Packaging for harsh environments
- Microsystems
- Piezoelectric components
- MEMS sensors and actuators
- Opto-mechanical devices
- Nano-electronic mechanical devices
- Bio-MEMS/NEMS
- Microfluidics
- LED lighting
- Smart systems of 2nd and 3rd generation
- Electronic control units for harsh environment
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