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EuroSimE 2016: IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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This event will take place in Montpellier, France, 17-20 April 2016.

What
  • Conference
When 17 April 2016 09:00 AM to
20 April 2016 05:00 PM
Where Montpellier, France
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The conference will address the results of both fundamental research and industrial applications for thermal, mechanical and multiphysics simulation and experiments of micro/nano-electronics and microsystems.

Short courses will be offered for professional training on 17 April 2016. Three days of technical sessions (18-20 April 2016)   for   oral   and   poster   presentations   are   planned,   in   parallel   with   an   exhibition   of suppliers   of   experimental characterization equipment, and simulation and optimization demonstrating their latest features.

EuroSimE 2014

Topics

  • Multi-physics   simulation   (e.g.   thermal,   mechanical,   thermo-mechanical,   coupled   thermo-fluidic,   coupled   electro-mechanics, fluid structure interactions)
  • Material characterisation, experiments and modelling 
  • Integrated process modelling
  • Simulation-based   optimisation,   virtual   prototyping   in   product and/or process design
  • Advanced   numerical   and   analytical   simulation   methodologies and tools
  • Multiscale modeling and simulation
  • Compact modelling and model order reduction
  • Behavioural modelling
  • Validation of simulations by experiments
  • Failure analysis and failure mode extraction
  • Failure criteria and damage modelling for reliability prediction
  • NEW: Prognostics and Health Monitoring
  • NEW: 3D Printing, 3D packaging

Applications

  • Components and packaging
    • Flip-chip,   BGA,   CSP,   Wafer-Level   packages,   MCM, Cu/low-k packages
    • 3-D packaging
    • Opto-electronic packages
    • High temperature and high power packaging
    • Packaging for harsh environments
  • Microsystems
    • Piezoelectric components
    • MEMS sensors and actuators
    • Opto-mechanical devices
    • Nano-electronic mechanical devices
    • Bio-MEMS/NEMS
    • Microfluidics
  • LED lighting
  • Smart systems of 2nd and 3rd generation
  • Electronic control units for harsh environment

Important Links

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