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ATW MEDICAL 2014: 2nd Advanced Technology Workshop on Microelectronics, Systems and Packaging For Medical Applications

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The motto of the event is “Enabling technologies for a better life and future”. The event will take place in Lyon, 10 - 11 December 2014.

  • Conference
When 11 December 2014 09:00 AM to
12 December 2014 05:00 PM
Where Lyon Metropole Congress Hotel, Lyon, France
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About the Event

At the ATW MEDICAL 2014, we will provide you with excellent presentations and exhibitors of most recent research and development results worldwide. Bringing together the microelectronics implantable and wearable, administrative regulations and marketing professionals. The variety of sessions offer the possibility to enhance professional development, technical knowledge/skills and enables career progression. Furthermore, the industrial exhibition will highlight materials, products, equipment and service applications of the current technology. We look forward to welcoming you to an inspiring and stimulating event.

The conference is an important platform for the dialogue between industry (manufacturers) and academia (researchers). Don’t miss the opportunity to meet international experts and exchange experience, ideas and cutting edge information of microelectronics and packaging industries at the ATW MEDICAL 2014.


Call for Papers

Download the Call for Abstracts >>here

Abstracts submission is requested by September 10th 2014 on following topics for 25 minutes presentation:
  • Markets Trends, Applications, Regulations and Public Certification
  • Implantable and Wearable Devices for New Diagnostics and Therapies
  • Supply Chain, Standardization, Data Security and Safety, Legislation
  • New Materials and Emerging Technologies
  • Electronic Miniaturization for Medical Applications

Abstracts should be a minimum of 250 words.

Please also include mailing address, business telephone number
Content must be without commercial information.

Please submit abstracts to imaps.france@imapsfrance.org

Autors will be notified of paper acceptance with instructions for its publication before October 15th 2014.

Speakers will receive 20% discount on registration fees.


For more than 40 years IMAPS is the leading Microelectronics Packaging, Interconnect and Assembly society, facilitating means of communication, education and interaction at all levels. IMAPS is dedicated to the advancement and growth of the community, with focus on developments in packaging technologies of the present and future (3D Integration, SMT, CoB- and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, MEMS, High Frequency, Advanced Materials, Modelling/Design/Simulation, Reliability amongst others).

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