EuroSimE 2019: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Eurosime Logo square


Hannover, Courtyard Hannover Maschsee
EPoSS participating

The 20th EuroSimE will be held in the city of Hannover, Germany, end of March 2019, with the support of Gottfried Wilhelm Leibniz Universität Hannover , Institute of Microelectronic Systems, as local organiser.

Local Organiser is apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage

2019 industry keynotes by:

  • Udo-Martin Gómez (Robert Bosch GmbH) on MEMS and IC Packaging for Automotive Applications
  • Ahmer Sayed (Qualcomm) on Package Developments at Qualcomm
  • Darrel Frear (NXP) on Package Development for Autonomous Driving

Call For Papers: June 1st 2018

Deadline to submit abstracts: October 30 2018

Notification of acceptance: December 15 2018

Deadline for submitting manuscript: March 1st 2019

EuroSimE short courses (free for conference attendants, otherwise paying): March 24, 2019

EuroSimE conference and exhibition: March 25-26-27, 2019