ESTC 2010 – 3rd Electronic System Integration Technology Conference

ESTC 2010 is your chance to present your research results to a high-caliber professional audience. Meet up with key researchers, decision-makers and standards bodies working in microelectronic packaging.

Call for Papers

ESTC 2010 seeks original papers describing research in all areas of electronic packaging. Papers may be submitted to the following tracks (see also Conference Topics below):

• Advanced packaging
  
• Microsystem packaging
  
• New materials and processes
  
• Optoelectronics
  
• Assembly and manufacturing technology
  
• Modelling and simulation
  
• Applied reliability
  
• Power electronics
  
• Electrical design and modelling
  
• Emerging technologies
  

Please submit your abstract for a paper or a poster by February 1, 2010 at the latest. To submit online follow the authors instructions. 

Key Dates

• Submission deadline for abstracts: February 1, 2010
  
• Notification of paper acceptance: April 1, 2010
  
• Final papers due: June 1, 2010

Exhibition

Join the concurrent exhibition and make Berlin your gateway to Europe by meeting representatives of all the major European players from industry (e.g. Bosch, Infineon, Henkel, Nokia, NXP Semiconductors, Philips, Pirelli, Siemens, ST Microelectronics) and the key research centers (e.g. Fraunhofer, IMEC, LETI). Use the opportunity to present your products and services to a select expert audience!